PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.
PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.
|Print settings||Mechanical properties||Thermal properties||Notes|
250˚C – 270˚C
2223 ± 199 Mpa
|Glass Transition Temperature:
100˚C for 8h
30mm/s – 60mm/s
66.2 ± 0.9 Mpa
|Vicat Softening Temperature:
|Recommended Support Materials:
25˚C – 50˚C
97.0 ± 1.1 Mpa
It is highly recommended to dry the filament before printing with PolyMide™ CoPA and to store it in the resealable bag.
To ensure a good heat resistance of your printed part it is recommended to anneal your PolyMide™ CoPA 3d printed model.
Annealing settings: 80˚C for 6h
Glass bed with 3DLac
|Charpy Impact Strength:
9.6 ± 1.4 kJ/m2
|When used extensively, PolyMide CoPA can be abrasive to brass nozzles. When using PolyMide CoPA, we recommend to switch to a wear resistant nozzle such as hardened steel nozzle.|
PolyMide™ CoPA features Polymaker's Warp-Free™ technology:
Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.